Semiconductor News & Analysis Feed
20 articles
2026-08-21
www.electronicdesign.com
2026-08-21
2026-08-21
www.electronicdesign.com
2026-08-21
2026-08-20
www.electronicdesign.com
2026-08-20
2026-08-19
news.google.com
2026-08-19
2026-08-17
eetimes.com
2026-08-17
As automotive electronic systems grow increasingly complex, engineers must meet stringent electromagnetic compatibility (EMC), signal integrity (SI), and power integrity (PI) requirements while adhering to strict automotive functional safety standards (ASIL). Often, design issues surface too late in
2026-08-11
thequantuminsider.com
2026-08-11
OpenLight and Tower Semiconductor have collaborated to enable photonic IC design on InP-on-Silicon platforms by integrating OpenLight’s Process Design Kit (PDK) into Cadence’s electronic design automation (EDA) tools. This integration streamlines the development of advanced photonic integrated circu
2026-08-08
2026-08-06
www.electronicdesign.com
2026-08-06
2026-07-24
news.google.com
2026-07-24
2026-07-24
www.electronicdesign.com
2026-07-24
2026-07-16
www.ad-hoc-news.de
2026-07-16
2026-07-16
www.ad-hoc-news.de
2026-07-16
2026-07-16
www.electronicdesign.com
2026-07-16
2026-07-15
www.ad-hoc-news.de
2026-07-15
2026-07-15
eetimes.com
2026-07-15
The global Electronic Design Automation (EDA) market experienced robust growth in Q1 2026, with total revenue reaching $5.7 billion, up 12.7% year-over-year. This surge is largely driven by an increasing number of companies designing chips in-house, which has significantly boosted demand for EDA too
2026-07-14
2026-07-11
tomshardware.com
2026-07-11
Bambu Lab and Insta360 have launched a collaborative design contest titled 'Let’s Make It Luna Ultra Design Challenge', inviting users to create custom 3D-printed hardware for Insta360’s new dual-lens 8K gimbal camera, the Luna Ultra. This marks the first time a camera brand has officially establish
2026-07-10
www.tomshardware.com
2026-07-10
As AI models grow in size and complexity, memory bandwidth and thermal management have become critical bottlenecks for future chip performance. Recently, research teams from South Korea and Japan have introduced two innovative High-Bandwidth Memory (HBM) architectures aimed at overcoming the heat ch
2026-07-09
www.digitimes.com
2026-07-09
Foxconn is building an integrated semiconductor ecosystem spanning IC design, silicon carbide, and advanced packaging, marking a significant strategic move in the semiconductor industry. The company's IC design subsidiary is preparing for a Taiwan listing as early as 2026, potentially on the Taiwan
2026-07-09