Semiconductor News & Analysis Feed
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2026-07-10
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2026-07-10
digitimes.com
2026-07-10
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening a new front in the competition over advanced memory performance, yield and supply.
2026-07-10
digitimes.com
2026-07-10
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI), high-performance computing (HPC), data centers, and advanced memory demand are reshaping semiconductor sourcing. The deal extends US supply chain localization beyond wafer production and into upstream critical material
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.