Semiconductor News & Analysis Feed
12287 articles
2026-05-29
koreajoongangdaily.joins.com
2026-05-29
Korea JoongAng Daily
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2026-05-29
www.insidermonkey.com
2026-05-29
Insider Monkey
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2026-05-29
www.moomoo.com
2026-05-29
Moomoo
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May 29th - The industry of $Power semiconductor (LIST24211.HK)$ is trending lower today with 1 constituents up, 7
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.trefis.com
2026-05-29
Trefis
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2026-05-29
www.moomoo.com
2026-05-29
Moomoo
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2026-05-29
www.koreaherald.com
2026-05-29
The Korea Herald
New tie-up fuels hopes for Samsung's foundry orders
(AP-Yonhap)
Samsung Electronics and SK hynix have taken strategic stakes in Anthropic, the developer of the Claude artificial intelligence models, joining a funding round that valued the US startup at $965 billion, making it the world's most valuable AI company ahead of OpenAI.
The deal is also fueling expectations that Samsung could win futur
2026-05-29
www.chosun.com
2026-05-29
조선일보
By Yoo Jane
Published 2026.05.29. 14:15
Updated 2026.05.29. 14:27
On the 28th afternoon, indices display on an electronic board at Hana Bank's dealing room in Jung-gu, Seoul. /Newsis
The market capitalization gap between South Korea’s leading semiconductor stocks, Samsung Electronics and SK Hynix, is rapidly narrowing. Amid expectations of expanding demand for artificial intelligence (AI) semico
2026-05-29
www.trefis.com
2026-05-29
Trefis
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2026-05-29
seekingalpha.com
2026-05-29
Seeking Alpha
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2026-05-29
www.barrons.com
2026-05-29
Barron's
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2026-05-29
www.automotiveworld.com
2026-05-29
Automotive World
Infineon has introduced a 1300 V SiC power module operating at 205°C, 30 degrees above the industry standard, for EV inverter use
May 29, 2026
Infineon Technologies has introduced a 1300 V silicon carbide (SiC) power module for electric vehicle (EV) inverters, the first within its HybridPACK Drive family capable of continuous operation at 205°C, a 30°C increase over the 175°C industry standard.
2026-05-29
simplywall.st
2026-05-29
simplywall.st
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2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
Huawei plans to narrow semiconductor gap with TSMC using novel chip architecture
The Chinese tech giant unveiled a new scaling framework and LogicFolding technology aimed at matching 1.4-nanometer chi
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.ad-hoc-news.de
2026-05-29
AD HOC NEWS
Infineon, Stock
Infineon Stock Soars to 52-Week High on NVIDIA AI Deal and Price Hikes, Yet Overbought Signals Loom
29.05.2026 - 06:13:06 | boerse-global.de
Infineon shares surge 109% YTD, joining NVIDIA's AI ecosystem with GaN power tech. Revenue targets of €1.5B for AI by 2026, but technical indicators warn of a pullback.
Infineon Stock Soars to 52-Week High on NVIDIA AI Deal and Price Hikes,
2026-05-29
www.bloomberg.com
2026-05-29
Bloomberg.com
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2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
kfgo.com
2026-05-29
KFGO
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its