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2026-05-18
SK Hynix speeds Yongin fab buildout as memory crunch fuels capacity race - digitimes
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www.digitimes.com 2026-05-18 digitimes
SK Hynix is accelerating construction at its Yongin Semiconductor Cluster, as a tightening memory market pushes South Korea's top chipmakers to move faster on long-term capacity plans.The article requires paid subscription.Subscribe Now
Semiconductor ManufacturingMemory ChipsChip CapacitySouth Korean SemiconductorsStorage MarketWafer Fab ConstructionSupply Chain TightnessSemiconductor Investment
2026-05-18
ASML, Tata Electronics Partner on India's First 300-mm Fab - EE Times
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news.google.com 2026-05-18 EE Times
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2026-05-18
TSMC's Japan fab signals a turning point for overseas manufacturing - digitimes
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www.digitimes.com 2026-05-18 digitimes
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2026-05-18
ASML and Tata Electronics partner on India semiconductor fab - eeNews Europe
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www.eenewseurope.com 2026-05-18 eeNews Europe
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2026-05-18
India's Tata Electronics partners with ASML to support first 300mm fab ramp-up - digitimes
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www.digitimes.com 2026-05-18 digitimes
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2026-05-18
Canada Spins Off Photonics Lab
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eetimes.com 2026-05-18 Gary Hilson
The Canadian Photonics Fabrication Center will be commercialized to scale up its compound semiconductor and photonics capabilities.
Photonics ManufacturingSemiconductor IndustryCanadian GovernmentPhotonics LabIII-V SemiconductorsPhotonic ChipsAI InfrastructureOptical Communication
2026-05-18
ASML, Tata Electronics Partner for India’s First 300-mm Semiconductor Fab
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eetimes.com 2026-05-18 Yashasvini Razdan
Strategic deal brings Dutch lithography giant's technology to Gujarat facility.
Semiconductor ManufacturingWafer Fab300mm WaferASMLTata ElectronicsIndia SemiconductorLithography EquipmentDholera Fab
2026-05-18
TSMC’s Kumamoto fab swings to profit in Q1 - Taipei Times
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www.taipeitimes.com 2026-05-18 Taipei Times
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2026-05-17
ASML to equip India’s first commercial chip fab — $11 billion Dholera project targets 50,000 wafers a month - Tom's Hardware
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www.tomshardware.com 2026-05-17 Tom's Hardware
Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article0Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterASML and Tata Electronics havesigned a memorandum of understandingto deploy ASML's lithography equipment at India's first front-end semiconductor fab, a 300mm facility under construction in Dholera, Gujarat.The deal was s
Semiconductor ManufacturingWafer FabASMLIndia SemiconductorDholera ProjectChip EquipmentSupply ChainGovernment Support
2026-05-17
Tata Electronics partners with ASML to build India’s first semiconductor fab - Crypto Briefing
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cryptobriefing.com 2026-05-17 Crypto Briefing
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2026-05-17
Tata Electronics partners with ASML to build India’s first semiconductor fab - Crypto Briefing
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cryptobriefing.com 2026-05-17 Crypto Briefing
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2026-05-17
Tata Electronics and ASML partner on India's first semiconductor fab - Yahoo Finance Singapore
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sg.finance.yahoo.com 2026-05-17 Yahoo Finance Singapore
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2026-05-17
Tata Electronics and ASML partner on India's first semiconductor fab - Reuters
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www.reuters.com 2026-05-17 Reuters
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2026-05-17
ASML Partners with Tata Electronics for $11B Semiconductor Fab i - GuruFocus
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www.gurufocus.com 2026-05-17 GuruFocus
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2026-05-16
Tata Electronics, ASML join hands to power India’s first commercial semiconductor fab - Moneycontrol.com
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www.moneycontrol.com 2026-05-16 Moneycontrol.com
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semiconductor manufacturingIndia semiconductor industryTata ElectronicsASML3nm processEUV lithographysemiconductor investmentIndia manufacturing
2026-05-16
TSMC to deploy $20B into Arizona subsidiary as chip giant expands Phoenix fab site - KTAR News 92.3 FM
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ktar.com 2026-05-16 KTAR News 92.3 FM
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2026-05-16
Neon Gas Market Forecast Points Higher Toward 2035, Driven by Semiconductor Fab Expansion and Laser Technology Upgrades - IndexBox
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www.indexbox.io 2026-05-16 IndexBox
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2026-05-16
TSMC's Kumamoto unit fab swings to profit in Q1 - Focus Taiwan
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focustaiwan.tw 2026-05-16 Focus Taiwan
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2026-05-15
Forge Nano Delivers Semiconductor Wafer Fab Equipment to Leading Fortune Global 500 Communications Company for Commercial Photonics Applications - AZoM
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www.azom.com 2026-05-15 AZoM
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2026-05-14
IC‑Link by imec joins TSMC 3DFabric Alliance to expand advanced packaging capabilities - New Electronics
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www.newelectronics.co.uk 2026-05-14 New Electronics
The 3DFabric Alliance forms part of TSMC’s broader ecosystem and is designed to support innovation and adoption of advanced integration techniques. These include a range of 2.5D and 3D packaging technologies such as SoIC, CoWoS, InFO and wafer-level integration platforms. Through participation in the alliance, IC‑Link will gain access to these technologies while contributing its design and manufac
Advanced Packaging3D IntegrationChip DesignTSMCSemiconductor EcosystemChip ManufacturingSystem IntegrationArtificial Intelligence