Semiconductor News & Analysis Feed
112 articles
2026-05-28
www.ad-hoc-news.de
2026-05-28
AD HOC NEWS
ASML, Presses
ASML Presses Ahead with €16M Daily Buybacks as High-NA EUV Adoption Splits Chip Giants
28.05.2026 - 13:03:26 | boerse-global.de
ASML continues aggressive share buyback, spending ~€16M daily, as High-NA EUV lithography splits customer base; Q1 revenue €8.8B, 2026 outlook €36-40B.
ASML Presses Ahead with €16M Daily Buybacks as High-NA EUV Adoption Splits Chip Giants - Foto: über boer
2026-05-28
tspasemiconductor.substack.com
2026-05-28
semivision
ASML’s EUV Power Strategy: More Wafers per Kilowatt-Hour, Not Just Smaller Nodes
Original Article By SemiVision Reserach [Reading time: 21 mins]
SEMIVISION
MAY 28, 2026
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ASML’s EUV Power Strategy: More Wafers per Kilowatt-Hour, Not Just Smaller Nodes
The semiconductor industry is entering a new constraint in capacity expansion: power.
In the past, when the industry discussed adv
2026-05-28
tspasemiconductor.substack.com
2026-05-28
semivision
ASML’s EUV Power Strategy: More Wafers per Kilowatt-Hour, Not Just Smaller Nodes
Original Article By SemiVision Reserach [Reading time: 21 mins]
SEMIVISION
MAY 28, 2026
∙ PAID
1
1
Share
ASML’s EUV Power Strategy: More Wafers per Kilowatt-Hour, Not Just Smaller Nodes
The semiconductor industry is entering a new constraint in capacity expansion: power.
In the past, when the industry discussed adva
2026-05-27
news.google.com
2026-05-27
EDN - Voice of the Engineer
2026-05-27
wccftech.com
2026-05-27
Wccftech
After Huawei made a big announcement earlier this week about its Tau scaling technology, through which it aims to achieve a transistor density similar to the 14 Angstrom (14A) manufacturing process technologies from leading chip manufacturers such as TSMC and Intel, semiconductor analyst Dr. Ian Cutress believes that the announcement compares unrelated aspects of a chip's performance specification
2026-05-27
wccftech.com
2026-05-27
Wccftech
After Huawei made a big announcement earlier this week about its Tau scaling technology, through which it aims to achieve a transistor density similar to the 14 Angstrom (14A) manufacturing process technologies from leading chip manufacturers such as TSMC and Intel, semiconductor analyst Dr. Ian Cutress believes that the announcement compares unrelated aspects of a chip's performance specification
2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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Reference #18.49102017.1779872430.efc3d8b9
https://errors.edgesuite.net/18.49102017.1779872430.efc3d8b9
2026-05-27
eetimes.com
2026-05-27
We now know what China’s been working on to counter U.S. sanctions on EUV technology.
2026-05-27
www.01net.it
2026-05-27
01net
www.01net.it
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2026-05-27
news.google.com
2026-05-27
EE Times Asia
2026-05-27
www.geneonline.com
2026-05-27
geneonline.com
Entegris and JSR Corporation/Inpria Corporation announced a non-exclusive cross-licensing agreement pertaining to extreme ultraviolet (EUV) lithography. The agreement involves the licensing of intellectual property related to EUV lithography technology.
The cross-licensing agreement allows both companies to utilize each other’s patents in the field of EUV lithography. This arrangement is non-excl
2026-05-27
semiengineering.com
2026-05-27
Gregory Haley
As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvil...
2026-05-27
www.marketscreener.com
2026-05-27
marketscreener.com
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Reference #18.8dc83017.1779840640.13a2e6a0
https://errors.edgesuite.net/18.8dc83017.1779840640.13a2e6a0
2026-05-27
www.tradingview.com
2026-05-27
TradingView
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2026-05-27
aijourn.com
2026-05-27
The AI Journal
BILLERICA, Mass. & TOKYO–(BUSINESS WIRE)–Entegris, Inc. (Nasdaq: ENTG), a global leader in advanced materials and purity solutions for the semiconductor industry, and JSR Corporation, a materials innovation leader and the parent company of Inpria Corporation, today announced entry into a non-exclusive cross-licensing agreement aimed at helping the semiconductor industry advance extreme ultraviolet
2026-05-27
news.google.com
2026-05-27
Business Wire
2026-05-27
www.stocktitan.net
2026-05-27
Stock Titan
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2026-05-26
eetimes.com
2026-05-26
Huawei's answer to Moore's Law without EUV promises 14A performance by 2031.
2026-05-26
www.actuia.com
2026-05-26
Actu IA
Artificial intelligence/Huawei Announces LogicFolding: 3D Density Without EUV Machines, Targeting 1.4 nm by 2031
Table of contents
A Temporal Scaling Law to Succeed Moore
LogicFolding: 3D Against EUV, and Its Shades
A 3D Architecture That Isn't Uniquely Huawei's
He Tingbo, the Tutelary Figure of HiSilicon
On May 25, 2026, He Tingbo, president of Huawei's semiconductor department and board member
2026-05-26
www.ad-hoc-news.de
2026-05-26
AD HOC NEWS
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