Semiconductor News & Analysis Feed

As AI models grow in size, hardware designers face new challenges: placing more memory closer to processors, reducing energy consumption in data movement, and managing rising power density in cooling systems. CEA-Leti’s Pascal Vivet emphasizes that 3D integration and chiplet-based architectures are

Recent reports suggest an unnamed Chinese company is developing deep ultraviolet lithography equipment for semiconductor fabrication, causing a short-term dip in ASML's stock. However, analysis indicates that while China is entering the market, its current technology and production capacity lag sign