Semiconductor News & Analysis Feed
315 articles
2026-06-22
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2026-06-22
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Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion (approx. US$495.3 million) over the next five years to expand production of advanced ceramic materials used in chip...
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2026-06-22
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2026-06-22
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According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been added to its internal product roadmap and is expected to launch in the first quarter of 2028, potentially making its public...
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2026-06-22
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2026-06-22
Below are the most-read DIGITIMES Asiastories from the week of June 15-21, 2026:
2026-06-22
digitimes.com
2026-06-22
The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMEShas been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates emerging as the most closely watched variable in that story.
2026-06-22
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2026-06-22
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Taiwan-based Tongtai Machine & Tool is accelerating its transformation toward high-value manufacturing, leveraging growing opportunities in AI servers, semiconductors and aerospace. At its annual general meeting on June 17, shareholders approved all proposals...
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2026-06-22
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2026-06-22
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Amid growing localization efforts across China's supply chain, FineMat Applied Materials has seen its metal mask business continue to shrink and is accelerating its transition into AI cooling, semiconductors, and drones. The company's liquid-cooling cold...
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2026-06-20
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2026-06-20
digitimes
The Trump administration has confronted ASML with concerns that one of the Dutch company's most advanced chip-making machines may have made its way into China in violation of US-led export restrictions, Bloomberg reported, citing people familiar with the...
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2026-06-19
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2026-06-19
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2026-06-19
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2026-06-19
digitimes
US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform.
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2026-06-19
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2026-06-19
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2026-06-18
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2026-06-18
digitimes
Power is now compute, and it is becoming a major driver of AI data center build costs. Renesas technical director Mu-Sen Lin said traditional data centers rely on low-voltage AC (LVAC), long wiring runs, and repeated AC-to-DC conversions through...
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2026-06-18
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2026-06-18
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As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."...
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2026-06-18
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2026-06-18
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Samsung Foundry’s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay...
2026-06-18
digitimes.com
2026-06-18
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
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2026-06-18
digitimes
SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry...
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2026-06-17
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2026-06-17
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Li Auto announced details of its new Mach M100 chip, a self-developed 5nm chip focused on autonomous driving, on June 15. This development marks the latest entry among Chinese automakers into designing in-house chips as they compete on cost and smart-driving...
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2026-06-17
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2026-06-17
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InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power component leader Infineon in China. Supply-chain sources said the two...
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2026-06-17
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2026-06-17
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Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data...
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2026-06-17
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2026-06-17
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AI infrastructure is increasingly dependent on light, and more of that technology is being built in Texas. Coherent's new Sherman expansion, backed by public and private funding, could strengthen global supply chains for the lasers and optical components that...
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