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Trending Companies
NVIDIA15 Google6 SK Hynix5 TSMC5 AMD5 Samsung Electronics4 Intel4 Synopsys4 Amazon4 Samsung3 SK hynix3 Apple3
Trending Technologies
EUV9 3nm8 HBM6 AI6 data center5 AI chips4 GPU4 cloud computing3 AI chip design3 NAND flash2 3D stacking2 Flexible OLED2
2026-09-01
Breaking traditional ceramic aerogel processing limits: Room-temperature “ceramic papermaking” coupled with high-temperature CVI creates multiscale SiC fiber/nanowire aerogels for broadband EMW absorption and thermal protection integration - EurekAlert!
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www.eurekalert.org 2026-09-01
2026-08-31
Microelectronics & Semiconductor Innovation Exchange Coming to Ann Arbor - DBusiness Magazine
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news.google.com 2026-08-31
2026-08-29
Hudbay Minerals Inc (HBM) Shares Fall 3.5% -- GF Value Says Stil - GuruFocus
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news.google.com 2026-08-29
2026-08-28
SK Hynix held a groundbreaking ceremony for its packaging facility in Indiana, USA, and signed a research and development MOU with Purdue University. - expreview.com
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www.expreview.com 2026-08-28
2026-08-28
SK hynix holds groundbreaking ceremony for HBM production base in US - The Korea Herald
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www.koreaherald.com 2026-08-28
2026-08-28
(LEAD) SK hynix holds groundbreaking ceremony for HBM production base in U.S. - Yonhap News Agency
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en.yna.co.kr 2026-08-28
SK Hynix held a groundbreaking ceremony for its High Bandwidth Memory (HBM) production facility in West Lafayette, Indiana, on August 27, 2026. The $4 billion investment marks SK Hynix's first next-generation HBM production hub in the U.S., with plans to begin mass production of HBM4E chips in the s
Semiconductor ManufacturingHBM TechnologyAI ChipsU.S. Semiconductor InvestmentSK HynixSupply Chain SecurityAdvanced PackagingKorea-U.S. Tech Cooperation
2026-08-28
SK hynix holds groundbreaking ceremony for $4 billion chip facility - Purdue Exponent
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www.purdueexponent.org 2026-08-28
2026-08-28
Senator Young Attends SK Hynix Groundbreaking Ceremony in West Lafayette - Senator Young (.gov)
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www.young.senate.gov 2026-08-28
2026-08-28
SK hynix holds groundbreaking ceremony for HBM production base in U.S. - Yonhap News Agency
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en.yna.co.kr 2026-08-28
2026-08-28
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US-Korea AI” - SK hynix
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news.skhynix.com 2026-08-28
2026-08-28
SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, 'Beginning a New Future for US-Korea AI' - The Manila Times
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www.manilatimes.net 2026-08-28
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Forth.News
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www.forth.news 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - The Mighty 790 KFGO
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kfgo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - KELO-AM
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kelo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WKZO
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wkzo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WTVB
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wtvbam.com 2026-08-27
SK Hynix held a groundbreaking ceremony for a $4 billion AI chip packaging facility in West Lafayette, Indiana, marking a major expansion of its U.S. operations amid surging demand for high-bandwidth memory (HBM) driven by artificial intelligence. The facility, expected to begin cleanroom operations
SK HynixAI chipHBM4ESemiconductor manufacturingUS investmentChip packagingArtificial IntelligenceMemory chip
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Reuters
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www.reuters.com 2026-08-27
2026-08-25
DB HiTek Targets Indian Foundry Growth with electronica India Debut - EE Times India
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news.google.com 2026-08-25
2026-08-25
Best AI Chip Stocks to Watch: Micron and MongoDB Slide Before Nvidia Earnings, August 24, 2026 - StartupHub.ai
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www.startuphub.ai 2026-08-25
2026-08-22
DB HiTek to Participate in electronica India Trade Fair - thelec.net
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www.thelec.net 2026-08-22