Semiconductor News & Analysis Feed

The collaboration between MAHLE and Infineon in data center cooling solutions represents a significant development in the semiconductor industry's response to increasing thermal management challenges. As data center computing densities and power consumption continue to rise with AI, 5G, and cloud te

SK hynix has launched its iHBM (integrated high-bandwidth memory) solution to address thermal challenges in next-generation AI memory chips. As demand for AI and high-performance computing grows, HBM technology advances toward higher stacking and faster speeds, intensifying heat dissipation issues.