digitimes.com
2026-07-12
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the next major battlegrounds in AI infrastructure.
www.ad-hoc-news.de
2026-07-04
Ad-hoc-news.de
Kinsus, TW0003189007
Kinsus Interconnect Tech outlines its role in advanced packaging. The company positions for long-term growth in global chip demand
Veröffentlicht: 04.07.2026 um 13:36 Uhr, Redaktion AD HOC NEWS, Redaktionelle Verantwortung: Rafael Müller (Chefredaktion)
Kinsus Interconnect Tech is a Taiwan-based provider of IC substrates and advanced packaging solutions. The company supplies
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.