Semiconductor News & Analysis Feed
301 articles
2026-06-18
digitimes.com
2026-06-18
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com
2026-06-18
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment mechanism to guarantee customers priority access to capacity.
2026-06-18
digitimes.com
2026-06-18
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's existing production capacity. The announcement comes amid another round of price increases in the passive components industry.
2026-06-18
www.tradingview.com
2026-06-18
TradingView
News
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GuruFocus
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AMD, Intel Rise as TSMC Capacity Tightens
AMD, Intel Rise as TSMC Capacity Tightens
Less than 1 min read
AMD
+3.49%
INTC
+4.40%
Advanced Micro Devices (AMD, Financials) and Intel moved higher as investors reacted to fresh signs that advanced chipmaking capacity remains tight. AMD rose about 3% in premarket trading. Intel gained roughly 4%.
The move followed a report that Samsu
2026-06-17
www.quiverquant.com
2026-06-17
Quiver Quantitative
ASML Holding N.V. (ASML) is up 5.9% today. Here is some analysis on what might have caused this price movement.
Analysis: The move appears tied to renewed optimism that ASML can expand EUV tool output more than previously modeled, improving the company’s medium-term revenue and margin runway. That theme has been reinforced by a wave of higher sell-side price targets and by ASML’s own strong 2026
2026-06-17
www.tipranks.com
2026-06-17
TipRanks
www.tipranks.com
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2026-06-17
www.investing.com
2026-06-17
Investing.com
www.investing.com
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2026-06-17
digitimes.com
2026-06-17
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
2026-06-17
digitimes.com
2026-06-17
Powerchip Semiconductor Manufacturing (PSMC) announced on June 16 that, effective from May 22, 2026, it purchased semiconductor production facilities and machinery from Lam Research for use in wafer production, in a transaction totaling NT$1.04 billion (approx. US$32.94 million). The move comes as the company steps up investment in equipment and new technologies to seize artificial intelligence (A
2026-06-17
digitimes.com
2026-06-17
Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity in Malaysia, aiming to capture demand from a shifting global semiconductor supply chain.
2026-06-17
digitimes.com
2026-06-17
Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing into AI data center optical communications.
2026-06-17
digitimes.com
2026-06-17
Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asiareported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
2026-06-17
digitimes.com
2026-06-17
Poland is seeking major Taiwanese investment to strengthen its manufacturing base, a shift that could reshape Europe's supply chains and technology capacity. The plan spans electric vehicles, semiconductors, and industrial policy, and reflects how governments are adapting to geopolitical pressure and shortages in key global sectors.
2026-06-16
memeburn.com
2026-06-16
Memeburn
TL;DR
Google is reportedly in talks with Samsung to help manufacture its future AI chip, codenamed Icefish.
TSMC will likely remain the primary producer, but capacity constraints are pushing Google to diversify suppliers.
The move highlights how the AI boom is reshaping the global semiconductor industry and supply chains.
Google could soon give Samsung a major role in building one of its most ad
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month
16.06.2026 - 02:00:19 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.