SemiPulse — Semiconductor Intelligence

Nvidia characterizes LPX as niche silicon optimized for high-speed premium tokens

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digitimes.com 2026-05-22

Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market

Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys back US$125M UCLA Semiconductor Hub

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digitimes.com 2026-05-22

Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall

Taiwan rides chip-led export boom to bankroll industrial overhaul

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digitimes.com 2026-05-22

AI-driven demand and other emerging technologies kept Taiwan's export momentum strong in the first quarter of 2026, with exports reaching US$195.74 billion, rising 51% year on year. Economic growth hit 13.69%, the highest quarterly growth in 39 years. Taiwan's GDP is forecast to reach NT$32 trillion (US$1.02 trillion) in 2026.

Lam Research launches PLP Center of Excellence, replacing wafers with panels

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digitimes.com 2026-05-22

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng

Tata's Assam OSAT plant nears production as India expands chip manufacturing ambitions

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digitimes.com 2026-05-22

Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains.

EverDisplay appoints former Hua Hong executive as chairman in board overhaul

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digitimes.com 2026-05-22

China AMOLED panel maker EverDisplay Optronics completed a board reshuffle and senior management overhaul after a board meeting on May 20, appointing a former Hua Hong Semiconductor executive as chairman and naming a new general manager as it builds a new leadership team. The changes included a slate of shareholder-representative directors and retained an existing director, the firm announced.

Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC

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digitimes.com 2026-05-22

Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.

Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption

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digitimes.com 2026-05-22

Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome

TSMC supply chain material maker AMC rides AI packaging yield boom

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digitimes.com 2026-05-22

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.

AMD's Lisa Su says memory is becoming another pressure point for AI chips

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digitimes.com 2026-05-22

AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.

AMD deepens China packaging alliance with TF-AMD expansion in Suzhou

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digitimes.com 2026-05-22

AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.

BOE, Corning target glass substrates for AI chip packaging

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digitimes.com 2026-05-22

BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.

Nvidia earnings surpass expectations amid AI chip boom - LiveNOW from FOX

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www.livenowfox.com 2026-05-22 LiveNOW from FOX

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Rigetti jumps as CHIPS Act letter-of-intent outlines up to $100M in federal quantum R&D funding - Quiver Quantitative

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www.quiverquant.com 2026-05-22 Quiver Quantitative

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Nvidia CEO Jensen Huang acknowledges Huawei’s dominance in China’s AI chip market - Crypto Briefing

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cryptobriefing.com 2026-05-22 Crypto Briefing

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