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BE Semiconductor Industries (BESIY), a Netherlands-based semiconductor assembly equipment company, is capitalizing on the growing demand for hybrid bonding technology to expand its role in AI chip packaging. At its 2026 Investor Day, the company raised its long-term revenue target to €1.7–2.2 billio

BESI's latest report reveals that hybrid bonding and advanced packaging technologies are experiencing rapid growth, driven by upgraded targets and accelerated AI-driven adoption. Hybrid bonding technology, as a core component of advanced packaging, is propelling the semiconductor industry toward hig