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2026-07-22
Cadence Launches AuraStack AI Super Agent for PCB Design, Advanced Packaging - EE Times India
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news.google.com 2026-07-22 EE Times India
2026-07-22
Cadence Launches AuraStack AI Super Agent for PCB Design, Advanced Packaging - EE Times Asia
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news.google.com 2026-07-22 EE Times Asia
2026-07-17
Cadence Unveils AuraStack AI Super Agent for PCB - PlasticsToday
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www.plasticstoday.com 2026-07-17 PlasticsToday
2026-07-16
Cadence’s AuraStack AI Stack Addresses The PCB & Advanced Packaging Bottleneck That Is Eating 65% Of Engineers’ Time, With NVIDIA & TSMC Already Deploying It - Wccftech
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wccftech.com 2026-07-16 Wccftech
2026-07-16
Cadence AuraStack Extends Agentic Leadership Toward Advanced Packaging Design - The Futurum Group
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futurumgroup.com 2026-07-16 The Futurum Group
2026-07-16
Cadence launches agentic AI platform AuraStack AI Super Agent - Yahoo Tech
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tech.yahoo.com 2026-07-16 Yahoo Tech
2026-07-16
Cadence introduces AuraStack AI Super Agent - Engineering.com
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www.engineering.com 2026-07-16 Engineering.com
2026-07-16
Cadence launches agentic AI platform AuraStack AI Super Agent - verdict.co.uk
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www.verdict.co.uk 2026-07-16 verdict.co.uk
2026-07-16
Cadence Launches AuraStack, an AI Agent Platform for Circuit Boards and Chip Packaging - Technology Org
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www.technology.org 2026-07-16 Technology Org
2026-07-16
Cadence launches AuraStack AI for natural language PCB packaging design - NewsBytes
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www.newsbytesapp.com 2026-07-16 NewsBytes
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World?s First Agentic AI Platform for PCB and Advanced Packaging - marketscreener.com
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www.marketscreener.com 2026-07-16 marketscreener.com
2026-07-16
Cadence launches agentic AI platform for PCB and package design
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digitimes.com 2026-07-16
Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design.
2026-07-16
Cadence introduces AuraStack AI to offload tasks so engineers can design chips - GamesBeat
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gamesbeat.com 2026-07-16 GamesBeat
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging - Eagle-Tribune
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www.eagletribune.com 2026-07-16 Eagle-Tribune
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging - Mid Florida Newspapers
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www.midfloridanewspapers.com 2026-07-16 Mid Florida Newspapers
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging - The Joplin Globe
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www.joplinglobe.com 2026-07-16 The Joplin Globe
2026-07-16
Cadence's AuraStack agent melds AI with HPC to speed PCB, advanced packaging design - The Register
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www.theregister.com 2026-07-16 The Register
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging - Yahoo Finance
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finance.yahoo.com 2026-07-16 Yahoo Finance
2026-07-16
Cadence AuraStack debuts to boost PCB and packaging designers - Fierce Sensors
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www.fiercesensors.com 2026-07-16 Fierce Sensors
2026-07-16
Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging - Carroll County Mirror-Democrat
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www.mycarrollcountynews.com 2026-07-16 Carroll County Mirror-Democrat