Semiconductor News & Analysis Feed

The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global readers, the shift could shape future device performance, supply chains, and where advanced semiconductors are manufactured and assembled.

As artificial intelligence (AI) fuels an unprecedented surge in demand for advanced semiconductors, Applied Materials is deepening its commitment to one of Asia's most important chipmaking hubs.