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Unimicron prices US$1.355 billion overseas depositary receipt offering

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digitimes.com 2026-07-07

Unimicron Technology has priced a large overseas depositary receipt sale that could affect global investors monitoring Taiwan's electronics supply chain and semiconductor-related financing trends. The deal, which will fund foreign-currency purchases, is expected to reduce interest costs and strengthen the company's balance sheet, with potential benefits for shareholders worldwide.

Manufacturing Expands in June Amid Global Unrest

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eetimes.com 2026-07-07 News Desk

U.S. manufacturing expanded in June, but Middle East conflict impacted raw materials.

Manufacturing PMI Economic Recovery Supply Chain Disruption Inflation Labor Market Geopolitical Conflict Semiconductor Industry US Economy

Samsung, SK Hynix reportedly seek China-free chip tool buffer against US controls

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digitimes.com 2026-07-07

Samsung Electronics and SK Hynix are reportedly accelerating efforts to reduce China's role in their semiconductor supply chains in preparation for the possibility of tighter US export controls. The two companies are said to be restructuring their sourcing of materials, components, and manufacturing equipment that rely heavily on China, while gradually replacing some Chinese-made semiconductor too

Huawei's Mate 90 to debut Kirin 2026 processor built on Tau Law

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digitimes.com 2026-07-07

Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's

AI server demand tightens power device supply as lead times stretch to 270 days

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digitimes.com 2026-07-07

AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.

Japanese startup completes AI chip validation with Oppstar and UMC support, moves toward mass production

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digitimes.com 2026-07-07

Tokyo Artisan Intelligence said it has finished validating its Sting Ray test chip, a step that could broaden access to lower-power edge AI hardware for industries worldwide. The milestone highlights how startups and foundries are pushing specialized chips that may ease energy pressure from AI, even as they support real-time applications in factories, transport, and infrastructure.

Broadcom and Apple extend custom chip deal through 2031

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digitimes.com 2026-07-07

Broadcom has extended its custom chip supply agreement with Apple through 2031, strengthening a key supplier tie that could shape wireless connectivity, AI infrastructure, and device design for years. The move offers investors greater visibility, while global consumers may ultimately see faster, more integrated Apple hardware and network performance.

Analog IC supply squeeze intensifies, ADI extends lead times

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digitimes.com 2026-07-07

Analog Devices (ADI) has reportedly notified customers of extended delivery lead times for certain products, with lead times now reaching six months. The company has advised customers to place orders at least six months in advance to help secure an adequate chip supply.

6G base stations to become AI computing nodes, boosting advanced packaging demand

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digitimes.com 2026-07-07

While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.

Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides

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digitimes.com 2026-07-07

As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip

Is Texas Instruments’ (TXN) Index Reclassification Quietly Rewriting Its Long-Term Investment Identity? - simplywall.st

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simplywall.st 2026-07-07 simplywall.st

Qualcomm’s Snapdragon Reality Elite Ups the Stakes for Spatial AI - The Futurum Group

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futurumgroup.com 2026-07-07 The Futurum Group

6G base stations to become AI computing nodes, boosting advanced packaging demand - digitimes

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www.digitimes.com 2026-07-07 digitimes

Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience - Investing News Network

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investingnews.com 2026-07-07 Investing News Network