2870 articles
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.
2026-05-22
digitimes.com
2026-05-22
AIC's expansion from analog ICs into fiber-optic components and other products, and its inclusion in a major US cloud service provider's supply chain, extend order visibility to the first quarter of 2027, signaling global demand pressures and supply-chain implications for cloud infrastructure suppliers and telecom equipment markets worldwide.
2026-05-22
digitimes.com
2026-05-22
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market
2026-05-22
digitimes.com
2026-05-22
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall
2026-05-22
digitimes.com
2026-05-22
Amkor Technology today reaffirmed its commitment to strengthening advanced semiconductor packaging and test capabilities in the US through continued investment in its Arizona manufacturing operations.
2026-05-22
digitimes.com
2026-05-22
China AMOLED panel maker EverDisplay Optronics completed a board reshuffle and senior management overhaul after a board meeting on May 20, appointing a former Hua Hong Semiconductor executive as chairman and naming a new general manager as it builds a new leadership team. The changes included a slate of shareholder-representative directors and retained an existing director, the firm announced.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum and dinner with Taiwan supply chain partners, and an about one-hour summit forum. This time, AMD also made the rare announcement that it will invest more than US$10 billion in Taiwan's industrial ecosystem to accelera
2026-05-22
digitimes.com
2026-05-22
Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.
2026-05-22
digitimes.com
2026-05-22
Forcelead Technology said it expects stable operations through 2026 as it rolls out a touch-TDDI product and pursues new automotive display opportunities, a development with implications for global suppliers and aftermarket channels as automakers adopt more advanced cockpit features. The company aims to protect margins while expanding beyond its core display business.
2026-05-22
digitimes.com
2026-05-22
Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics is reportedly preparing to shift more of its gallium nitride (GaN) power semiconductor strategy toward foundry services after struggling to secure customers for its own GaN devices and modules, according to The Elec.
2026-05-22
digitimes.com
2026-05-22
Taiwan's semiconductor industry and the military implications of a potential cross-strait conflict dominated the aerospace and defense track on the second day of the Plug and Play Silicon Valley May Summit, as investors and defense technology executives described a geopolitical environment that is fundamentally reshaping where capital flows and why.
2026-05-22
digitimes.com
2026-05-22
South Korea announced a national plan to raise domestic production of defense semiconductors to 50% by 2029, targeting heavy reliance on US and Taiwan supply chains to bolster national security. The initiative, unveiled at the 2026 Advanced Strategic Semiconductor Innovation Conference, covers research and development, manufacturing, ecosystem building and workforce training and follows the recent
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.
2026-05-22
www.bloomberg.com
2026-05-22
Bloomberg.com
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2026-05-22
digitimes.com
2026-05-22
AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.
2026-05-22
digitimes.com
2026-05-22
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on next-generation 10A and 7A nodes.
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.