269 articles
2026-05-22
www.semiconductor-today.com
2026-05-22
Semiconductor Today
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2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome
2026-05-22
digitimes.com
2026-05-22
Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
On May 20, 2026, DIGITIMES held its Tech Forum, where senior analyst Jim Hsiao delivered a presentation, "AI server market outlook and trends amid the explosion of agent applications." In it, Hsiao explained that demand is rising sharply not only for x86 server CPUs from Intel and AMD, but also for Arm-based CPUs, which are expected to see explosive growth in 2026.
2026-05-22
digitimes.com
2026-05-22
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains in an early phase of growth.
2026-05-22
finance.yahoo.com
2026-05-22
Yahoo Finance
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2026-05-22
www.zacks.com
2026-05-22
Zacks Investment Research
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2026-05-22
www.fool.com
2026-05-22
The Motley Fool
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2026-05-21
tomshardware.com
2026-05-21
Anton Shilov
As memory content per rack increases in Vera Rubin platform, it now accounts for nearly 25% of its cost.
2026-05-21
seekingalpha.com
2026-05-21
Seeking Alpha
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2026-05-21
hothardware.com
2026-05-21
HotHardware
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2026-05-21
www.tipranks.com
2026-05-21
TipRanks
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2026-05-21
www.cnbc.com
2026-05-21
CNBC
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2026-05-21
www.marketbeat.com
2026-05-21
MarketBeat
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2026-05-21
finance.yahoo.com
2026-05-21
Yahoo Finance
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2026-05-21
finance.yahoo.com
2026-05-21
Yahoo Finance
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