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US AI startup Tensordyne claims 3nm Napier chip outperforms NVIDIA Blackwell by 13x in tokens per second
The TDN72 rack houses 288 Napier chips, delivers 608 petaflops of FP8 compute, and claims to match the throughput of nine NVIDIA Rubin plus Groq LPX racks.
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Hassam Nasir
Tech Reporter
Published Jun 16, 2026 12:15 AM CDT
1 minute & 45 seconds read time
TL;DR: Tensordyne's 3nm N
2026-06-16
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2026-06-16
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Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
PR Newswire
Mon, June 15, 2026 at 6:00 PM PDT 3 min read
New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that
2026-06-16
www.prnewswire.com
2026-06-16
PR Newswire
Rapidus Signs MoU with Fondazione Chips-IT in Italy for Future Semiconductor Manufacturing
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Rapidus Corporation
Jun 15, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and Italy
TOKYO, June 15, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the Fondazione
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
NAND flash memory supplier Kioxia Holdings has surpassed Toyota Motor in market capitalisation, becoming Japan's most valuable company. The development highlights how the global artificial intelligence (AI) boom is reshaping Japan's corporate landscape.
2026-06-16
digitimes.com
2026-06-16
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are responding to investor excitement and a need for cash to capitalize on the AI boom.
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
wccftech.com
2026-06-16
Wccftech
US-based AI company, Tensordyne, has announced the successful tape-out of its Napier chip, which it claims to demolish NVIDIA's Blackwell & Rubin chips with leading token throughput and efficiency.
The Napier chip will be the core component of the Tensordyne Napier TDN system, which is designed in collaboration with Broadcom and HPE Juniper Networks. The Napier platform has one goal: to unify AI
2026-06-15
eetimes.com
2026-06-15
As Rapidus signs an MoU with the UK Semiconductor Centre (UKSC), EE Times speaks exclusively with the UKSC's new CEO, Andy McLean.
2026-06-15
www.investing.com
2026-06-15
Investing.com
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2026-06-15
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2026-06-15
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2026-06-15
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Provided by PR Newswire Jun 15, 2026, 9:00:00 AM
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconducto
2026-06-15
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2026-06-15
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
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Rapidus Corporation
Jun 14, 2026, 21:00 ET
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New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it signed a Memorandum of Understanding (MoU) with the UK Semiconduct
2026-06-15
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2026-06-15
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Rapidus Signs MoU with UK Semiconductor Centre for Future Semiconductor Manufacturing
PR Newswire
Sun, 14 June 2026 at 6:00 pm GMT-7 3 min read
New collaboration provides framework between the Japan government and the UK
TOKYO, June 14, 2026 /PRNewswire/ -- Rapidus Corporation today announced that it