Semiconductor News & Analysis Feed
84 articles
2026-05-12
sourceability.com
2026-05-12
Sourceability
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2026-05-12
www.digitimes.com
2026-05-12
digitimes
TSMC is facing fierce customer competition and supply shortages as demand surges for artificial intelligence and high-performance computing chips, forcing fabless chipmakers to consider limited shifts in manufacturing partners to ease constraints.The article requires paid subscription.Subscribe Now
2026-05-11
news.google.com
2026-05-11
EE Times Asia
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2026-05-11
finance.yahoo.com
2026-05-11
Yahoo Finance
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2026-05-10
ts2.tech
2026-05-10
TechStock²
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2026-05-09
uk.finance.yahoo.com
2026-05-09
Yahoo Finance UK
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2026-05-09
www.tradingkey.com
2026-05-09
TradingKey
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2026-05-09
marklapedus.substack.com
2026-05-09
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Foundryecosystem Report: Terafab; capacity, EUV, GaN
How much does a fab cost? What is the cur
2026-05-08
news.futunn.com
2026-05-08
富途牛牛
访问频繁,请稍后重试您所要访问的页面不在这儿,它可能正忙着刷牛牛圈,稍后就能恢复正常返回主页
2026-05-08
www.tomshardware.com
2026-05-08
Tom's Hardware
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2026-05-08
www.benzinga.com
2026-05-08
Benzinga
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2026-05-08
finimize.com
2026-05-08
Finimize
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2026-05-07
wccftech.com
2026-05-07
Wccftech
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2026-05-07
www.kedglobal.com
2026-05-07
KED Global
Samsung Electronics Co. is accelerating construction of a new mega-fab at its Pyeongtaek semiconductor complex by at least six months as South Korea’s memory chipmakers and their global peers race to secure dominance in the booming artificial intelligence era.
2026-05-07
coincentral.com
2026-05-07
CoinCentral
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2026-05-07
www.digitimes.com
2026-05-07
digitimes
Nvidia and Corning announced a multiyear partnership to expand U.S.-based production of optical connectivity solutions for AI data centers. Corning will increase its U.S. optical connectivity manufacturing capacity by 10-fold and expand fiber production...The article requires paid subscription.Subscribe Now
2026-05-07
ts2.tech
2026-05-07
TechStock²
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2026-05-06
www.barrons.com
2026-05-06
Barron's
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2026-05-06
www.newelectronics.co.uk
2026-05-06
New Electronics
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly intense.One of the most persistent bottlenecks has been in advanced packaging, especially chip-on-wafer-on-substrate (CoWoS) technology. Shortages have extended beyond fabrication itself, affecting up
2026-05-05
www.tikr.com
2026-05-05
TIKR.com