Semiconductor News & Analysis Feed
401 articles
2026-07-10
www.digitimes.com
2026-07-10
digitimes
2026-07-10
www.digitimes.com
2026-07-10
digitimes
2026-07-10
digitimes.com
2026-07-10
SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging and leading-edge manufacturing equipment at the same time.
2026-07-10
digitimes.com
2026-07-10
Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.
2026-07-10
digitimes.com
2026-07-10
E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global chip makers, the shift could accelerate next-generation packaging capacity, reshape supplier spending, and bring advanced process tools into volume production sooner than expected.
2026-07-10
digitimes.com
2026-07-10
LG Innotek is moving ahead with a new semiconductor substrate manufacturing facility in Vietnam, marking its first overseas production base for IC substrates as the company seeks to expand capacity for advanced packaging products used in AI servers and high-end mobile devices.
2026-07-10
digitimes.com
2026-07-10
Sigurd said its revenue hit a record in the second quarter of 2026 and for the first half of the year, driven by stronger demand from overseas customers. June sales stayed at a high level, while the share of overseas revenue continued to rise as a major foreign client expanded capacity.
2026-07-10
digitimes.com
2026-07-10
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
2026-07-10
digitimes.com
2026-07-10
High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.
2026-07-10
digitimes.com
2026-07-10
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected mainstream packaging capacity while its major Chinese plants run on strong orders.
2026-07-10
digitimes.com
2026-07-10
Chunghwa Precision Test Tech president Scott Huang said on July 7 that the company's biggest challenge over the next five years will be capacity as artificial intelligence demand surges across the semiconductor supply chain. He also urged Taiwan to increase investment in quantum technology and nuclear fusion, saying both fields could shape the island's long-term industrial future.
2026-07-10
digitimes.com
2026-07-10
Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence analyst Luke Lin examined the actual progress of advanced-node capacity expansion at TSMC, Intel, and Samsung, arguing that market expectations in several areas have run ahead of reality.
2026-07-09
tomshardware.com
2026-07-09
Hassam Nasir
A Russian family has just saved the house $120 in GPU repairs after the father fixed it with a salvaged capacitor from an old radio.
2026-07-09
theedgemalaysia.com
2026-07-09
The Edge Malaysia
Science, Technology and Innovation Minister Datuk Chang Lih Kang (Photo by Zahid Izzani/The Edge)
KUALA LUMPUR (July 9): The government is targeting the advanced packaging technology developed through research and development (R&D) projects under the Malaysia Science Endowment (MSE) to be fully commercialised after a two-year capacity-building period, the Dewan Rakyat was told on Thursday.
Scien
2026-07-09
digitimes.com
2026-07-09
China's bid to replace Nvidia in AI chips faces a constraint more immediate than design capability: SMIC's limited 7nm-class manufacturing capacity.
2026-07-09
digitimes.com
2026-07-09
Yesiang, a major supplier of advanced process micro-contamination control filters, said rising demand from a top foundry customer is supporting stronger sales as the customer expands capacity. The company reported consolidated revenue of NT$247 million (US$7.7 million) in June 2026, up 3.71% from May and 101.60% from a year earlier, setting another record.
2026-07-08
www.ad-hoc-news.de
2026-07-08
AD HOC NEWS
TSMC, TW0002330008
TSMC CoWoS packaging service - capacity push for demanding AI chips
Veröffentlicht: 08.07.2026 um 14:17 Uhr, Redaktion AD HOC NEWS, Redaktionelle Verantwortung: Rafael Müller (Chefredaktion)
TSMC CoWoS packaging service is designed for high-bandwidth AI accelerators with multi-chip modules and advanced 2.5D integration. This product is driving the price of Taiwan Semiconductor
2026-07-08
timesofindia.indiatimes.com
2026-07-08
The Times of India
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2026-07-08
digitimes.com
2026-07-08
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
2026-07-08
tomshardware.com
2026-07-08
Jeffrey Kampman
More memory, more performance, more power. Maybe.