Semiconductor News & Analysis Feed

84 articles
2026-05-18
www.ad-hoc-news.de 2026-05-18 AD HOC NEWS
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2026-05-18
capacityglobal.com 2026-05-18 capacityglobal.com
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2026-05-18
www.digitimes.com 2026-05-18 digitimes
SK Hynix is accelerating construction at its Yongin Semiconductor Cluster, as a tightening memory market pushes South Korea's top chipmakers to move faster on long-term capacity plans.The article requires paid subscription.Subscribe Now
2026-05-18
www.digitimes.com 2026-05-18 digitimes
Following its North America technology forum, TSMC held the Hsinchu session on May 14, 2026. The company said the smart revolution is beginning, with AI evolving from generative AI and agentic AI to physical AI, driven by the power efficiency and performance...The article requires paid subscription.Subscribe Now
2026-05-17
www.ad-hoc-news.de 2026-05-17 AD HOC NEWS
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2026-05-17
www.ad-hoc-news.de 2026-05-17 AD HOC NEWS
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2026-05-17
www.ad-hoc-news.de 2026-05-17 AD HOC NEWS
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2026-05-16
simplywall.st 2026-05-16 simplywall.st
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2026-05-15
www.morningstar.com 2026-05-15 Morningstar
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2026-05-15
capacityglobal.com 2026-05-15 capacityglobal.com
HomeNewsTSMC’s $1.5tn chip forecast signals decade of pressure on AI data centre networksAITSMC’s $1.5tn chip forecast signals decade of pressure on AI data centre networks15 May 20264 minutesThe world's largest contract chipmaker, TSMC has revised its 2030 market projection upward by 50%, from just over $1 trillion to $1.5 trillion in the space of roughly two years.Saf MalikSenior Content and Ins
2026-05-15
www.electronicsweekly.com 2026-05-15 Electronics Weekly
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2026-05-15
www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
www.ad-hoc-news.de 2026-05-15 AD HOC NEWS
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2026-05-15
www.digitimes.com 2026-05-15 digitimes
In its first-quarter 2026 earnings Q&A session on May 15, Semiconductor Manufacturing International Corporation (SMIC) outlined a strategic response to shifting global market dynamics. As leading international foundries and integrated device manufacturers...The article requires paid subscription.Subscribe Now
2026-05-15
siliconangle.com 2026-05-15 SiliconANGLE
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2026-05-14
www.digitimes.com 2026-05-14 digitimes
TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities worldwide. At its 2026 Technology Symposium, TSMC vice president Bor-Zen...The article requires paid subscription.Subscribe Now
2026-05-13
www.theglobeandmail.com 2026-05-13 The Globe and Mail
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2026-05-13
eetimes.com 2026-05-13 Pat Brans
Spain coordinates Europe’s €400 million PIXEurope initiative to turn photonics research into scalable semiconductor manufacturing capacity.
2026-05-12
www.investing.com 2026-05-12 Investing.com
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2026-05-12
www.investing.com 2026-05-12 Investing.com
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