Semiconductor News & Analysis Feed
401 articles
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
ca.investing.com
2026-06-16
Investing.com Canada
ca.investing.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0c405067ac3f45a
Performance and Security by Cloudflare
Privacy
2026-06-16
www.investing.com
2026-06-16
Investing.com
www.investing.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0c3feee3ee9e977
Performance and Security by Cloudflare
Privacy
2026-06-16
letsdatascience.com
2026-06-16
Let's Data Science
FUNDING & BUSINESS
micron
hbm
market analysis
semiconductors
Micron's Sold-Out HBM Capacity Creates June 24 Catalyst
1 sources
|
June 15, 2026
5.5
Relevance Score
Photo: i-invdn-com.investing.com · rights & takedowns
QUICK SUMMARY
Hide
A Market Analysis highlights that Micron Technology Inc has sold out its HBM capacity and identifies June 24 as a make-or-break catalyst. The analysis also covers
2026-06-16
uk.investing.com
2026-06-16
Investing.com UK
uk.investing.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0ce3b44ba278005
Performance and Security by Cloudflare
Privacy
2026-06-16
www.tradingview.com
2026-06-16
TradingView
News
/
GuruFocus
/
Google's Samsung Talks Highlight TSMC Capacity Crunch
Google's Samsung Talks Highlight TSMC Capacity Crunch
Less than 1 min read
GOOG
+2.61%
Alphabet (GOOG, Financials) may be looking beyond Taiwan Semiconductor Manufacturing for part of its future AI chip production, and that says a lot about how tight the market has become.
Google is reportedly in talks with Samsung to make
2026-06-16
www.gurufocus.com
2026-06-16
GuruFocus
The owner of this website (www.gurufocus.com) has banned the autonomous system number (ASN) your IP address is in (45102) from accessing this website.
Please see https://developers.cloudflare.com/support/troubleshooting/http-status-codes/cloudflare-1xxx-errors/error-1005/ for more details.
Cloudflare Ray ID: a0c3f581fe7cc98b • Your IP: Click to reveal • Performance & security by Cloudflare
2026-06-15
www.gurufocus.com
2026-06-15
GuruFocus
The owner of this website (www.gurufocus.com) has banned the autonomous system number (ASN) your IP address is in (45102) from accessing this website.
Please see https://developers.cloudflare.com/support/troubleshooting/http-status-codes/cloudflare-1xxx-errors/error-1005/ for more details.
Cloudflare Ray ID: a0c27d2148623b06 • Your IP: Click to reveal • Performance & security by Cloudflare
2026-06-15
www.engineering.com
2026-06-15
Engineering.com
www.engineering.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0c236eb281ee613
Performance and Security by Cloudflare
Privacy
2026-06-15
www.moomoo.com
2026-06-15
Moomoo
__fail__
2026-06-15
news.futunn.com
2026-06-15
富途牛牛
__fail__
2026-06-15
datacentremagazine.com
2026-06-15
Data Centre Magazine
NVIDIA is strengthening its position in the AI infrastructure market through a series of agreements in South Korea that span memory supply, data centre development and AI-powered industrial systems.
During a four-day visit to Seoul, NVIDIA's CEO, Jensen Huang, secured agreements with SK hynix, SK Telecom, Naver, Doosan Group, LG Group and Hyundai Motor Group.
The financial terms to the partnersh
2026-06-15
evertiq.com
2026-06-15
Evertiq
© Liviorki for Evertiq
Business | June 15, 2026
CADFEM APAC, SilTerra partner to advance semiconductor innovation
Evertiq
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.
CADFEM APAC, a Hyderabad-ba
2026-06-15
www.indexbox.io
2026-06-15
IndexBox
This website is using a security service to protect itself from online attacks. The action you just performed triggered the security solution. There are several actions that could trigger this block including submitting a certain word or phrase, a SQL command or malformed data.
You can email the site owner to let them know you were blocked. Please include what you were doing when this page came u
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026 batch shipped at the end of May following an earlier release in 2025, easing a capacity bottleneck in the optical communications market. Taiwanese compound semiconductor suppliers including Visual Photonics Epitaxy (VPEC) and Global Communication Semiconductors (GCS)
2026-06-15
digitimes.com
2026-06-15
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports indicate that Google is not only set to adopt Intel's embedded multi-die interconnect bridge (EMIB) packaging for its next-generation product, but is also planning to bring in Samsung Electronics for front-end waf
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization