As AI computing demand continues to grow exponentially, pressure to upgrade data center network architectures is intensifying. Co-packaged optics (CPO) is moving from concept to real-world deployment, and Foxconn Industrial Internet (FII) is quietly building a strong market position by leveraging its existing strengths in CPO all-optical switches as well as AI servers.

Taiwan-based semiconductor facility engineering firm Trusval reported strong results for the first quarter of 2026, supported by continued growth in global AI computing demand, TSMC's accelerated expansion of 2nm process and advanced packaging capacity, and ongoing fab construction projects across the semiconductor, high-tech, and memory industries.

The global copper-clad laminate market expanded sharply as AI computing demand forced higher-spec hardware, and Taiwan's printed circuit board supply chain moved to secure second-source positions, industry data showed. The Taiwan Printed Circuit Board Association reported the copper-clad laminate market reached US$16.02 billion in 2025 and was projected to rise to US$21.5 billion in 2026 as server