Semiconductor News & Analysis Feed
886 articles
2026-06-15
www.benzinga.com
2026-06-15
Benzinga
Unfortunately your device has been prevented from accessing our system because of security concerns.
If you believe you are reaching this message in error please contact Benzinga Support at 1-877-440-9464 or email support@benzinga.com and please provide the ID number 47.253.216.184 to support.
2026-06-15
cryptobriefing.com
2026-06-15
Crypto Briefing
ByteDance in talks to acquire AI chips from Iluvatar CoreX in push away from Nvidia
TikTok's parent company is negotiating to buy at least 50,000 AI inference GPUs from the Shanghai-based chipmaker as
2026-06-15
memeburn.com
2026-06-15
Memeburn
TL;DR
Nvidia hired Bruce Andrews, Intel's former government affairs chief and Obama-era Commerce Department official, as its new Chief External Affairs Officer.
The chipmaker's lobbying expenditures surged from $640,000 in 2024 to nearly $5 million in 2025, roughly a 670% increase.
Andrews' appointment comes amid tighter US chip export controls, a June 2026 crackdown on Chinese subsidiary loophol
2026-06-15
digitimes.com
2026-06-15
LG Innotek plans to invest more than KRW1 trillion in a new semiconductor substrate plant in Haiphong, Vietnam, reflecting rising demand for substrates used in AI servers, 5G smartphones, and on-device AI chips. The expansion targets RF-SiP, FC-CSP, and FC-BGA substrates, as substrate suppliers adjust capacity plans to stronger demand from advanced mobile devices and AI infrastructure.
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization
2026-06-14
www.quiverquant.com
2026-06-14
Quiver Quantitative
Capacity Expansion Focus: Social media conversations center on TSMC's aggressive plans to construct multiple new fabrication facilities each year. Analysts note the firm's target of six-figure monthly wafer output by 2029 amid sustained high demand.
Supply Constraints Persist: Recent commentary emphasizes that TSMC's Arizona plant remains fully booked through 2027, with big tech clients continuin
2026-06-14
pulse2.com
2026-06-14
Pulse 2.0
Applied Materials announced the expansion of its manufacturing and research and development operations in Singapore with a new $500 million (S$600 million) Tampines Campus designed to support the growing global demand for semiconductors driven by artificial intelligence.
The new facility more than doubles the company’s advanced cleanroom capacity in Singapore and strengthens its global manufactur
2026-06-14
tradersunion.com
2026-06-14
Traders Union
Bill Gurley points out that discussions on AI chips in China often focus solely on Huawei, overlooking a broader ecosystem. He emphasizes that, similar to the U.S. having companies like Cerebras, Google TPU, Amazon Tanium, and AMD, China boasts a significant range of AI chip competitors. Gurley highlights Cambricon as an example, noting its $40 billion market cap and public listing.
2026-06-12
www.chosun.com
2026-06-12
조선일보
By Seongmin K
Published 2026.06.13. 00:44
Samsung Electronics Hwaseong Campus foundry. /Courtesy of Samsung Electronics
Samsung Electronics’ foundry business (semiconductor contract manufacturing) is approaching profitability as it secures more orders. The Information, a U.S. IT-focused media outlet, reported on the 11th (local time) that Google is considering producing components for its next-g
2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
Taiwan Semiconductor (TSM) Sees AI Chip Demand Outpacing Supply
Jeff Lewis
Fri, June 12, 2026 at 8:37 AM PDT 2 min read
TSM
+0.57%
NVDA
-0.18%
Explore stocks on Coinbase
Trading disclosure
Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the
7 Best Compounder Stocks to Buy Now.
On June 4, 2026, Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) CEO C.C. Wei sai
2026-06-12
www.investopedia.com
2026-06-12
Investopedia
__fail__
2026-06-12
www.tradingview.com
2026-06-12
TradingView
News
/
GuruFocus
/
Nvidia Opens Another AI Chip Door in China
Nvidia Opens Another AI Chip Door in China
Less than 1 min read
NVDA
−0.07%
Nvidia
NVDA
is pitching its new Vera CPUs to Chinese customers, opening a fresh path into the market as U.S. export controls continue to complicate GPU sales.
Reuters reported that Nvidia has told clients in China they may be able to start placing Vera order
2026-06-12
www.harianbasis.co
2026-06-12
HarianBasis.co
www.harianbasis.co
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0b27d8878e0d600
Performance and Security by Cloudflare
Privacy
2026-06-12
www.digitimes.com
2026-06-12
digitimes
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply chain as demand for advanced AI silicon strains capacity at TSMC.
Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit
2026-06-12
digitimes.com
2026-06-12
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers and supply chains, the shift suggests stronger demand for Taiwan's packaging and testing firms, alongside a broader rebalancing of semiconductor production.
2026-06-12
digitimes.com
2026-06-12
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply chain as demand for advanced AI silicon strains capacity at TSMC.
2026-06-12
digitimes.com
2026-06-12
Samsung Electronics is regaining ground in high-bandwidth memory and foundry services, but advanced packaging remains a weak point in its bid to capture a larger share of the AI chip supply chain, according to industry sources and Korean media reports.
2026-06-12
eetimes.com
2026-06-12
Rebellions leverages memory-centric AI chip designs with SK Hynix and Samsung to fuel IPO ambitions.
2026-06-11
stocktwits.com
2026-06-11
Stocktwits
stocktwits.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a0a23f465e1d3b08
Performance and Security by Cloudflare
Privacy
2026-06-11
wccftech.com
2026-06-11
Wccftech
With multiple supply chain reports focusing on Intel's EMIB-T chip packaging technology, analyst Ming-Chi Kuo has shared that TSMC's next-generation packaging technology, CoPoS, will enter mass production in 2028. CoPoS, short for chip-on-panel-on-substrate, seeks to overcome the limitations of the current CoWoS (chip-on-wafer-on-substrate) packaging technology by increasing the area on which the