Semiconductor News & Analysis Feed
18 articles
2026-06-25
www.igorslab.de
2026-06-25
igor´sLAB
LATEST NEWS
ASE is building 15 new sites: Advanced Packaging is becoming the next major AI bottleneck
25. June 2026 06:00Samir Bashir
📖 Reading time: approx. 9 minutes · 1,647 words · 10,736 characters
In the case of AI chips, people like to talk about transistors, HBM bandwidth, and compute performance. Eventually, however, the GPU, memory, chiplets, and power supply must actually be assembled i
2026-06-24
biz.chosun.com
2026-06-24
Chosunbiz
By
Jeong Du-yong
Published 2026.06.24. 06:01
Updated 2026.06.24. 07:06
Patent diagram for a processing core integrating high-capacity, high-bandwidth storage memory registered with the United States Patent and Trademark Office (USPTO) by SanDisk./Courtesy of United States Patent and Trademark Office
High-bandwidth flash (HBF) technology developed by SanDisk in the United States is drawing renew
2026-06-23
drrobertcastellano.substack.com
2026-06-23
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
The Most Critical AI Bottleneck — And Nvidia Could Change It Overnight
DR. ROBERT CASTELLANO
JUN 23, 2026
∙ PAID
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What’s in This Article
The Most Critical AI Bottleneck
How Nvidia Changed the Rules
Table 1. Nvidia AI Accelerator Product Cadence
HBM Content Growth Is Exploding
Table 2. HBM Content Growth by Nvidia Architecture
HBM Is Consuming the Memory Industry
Table 3. HBM Share of DRAM
2026-06-12
www.moomoo.com
2026-06-12
Moomoo
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2026-06-12
digitimes.com
2026-06-12
Breaking the inference barrier requires a rethink of the whole system architecture, not just faster compute. This was the key takeaway from a recent panel discussion at SuperAI Singapore, which brought chip makers and an AI model accelerator together to address how to overcome inference bottlenecks at a time when compute workloads are hitting up against physical limits.
2026-06-10
seekingalpha.com
2026-06-10
Seeking Alpha
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2026-06-02
www.datacenterdynamics.com
2026-06-02
Data Center Dynamics
Marvell CEO Matt Murphy called data center connectivity the next major bottleneck to AI growth, following the explosion in demand (and valuation) of compute and memory businesses.
Speaking at Computex, Murphy was joined by Nvidia CEO Jensen Huang to discuss the potential of connectivity to be the next investment wave.
– Sebastian Moss
"For the past several years, AI has created new demands on t
2026-06-01
www.barrons.com
2026-06-01
Barron's
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2026-05-31
www.ad-hoc-news.de
2026-05-31
AD HOC NEWS
From, Cyclical
From Cyclical Commodity to AI Bottleneck: How Micron’s Fully Booked HBM Pipeline Upended Its Stock and Split the Investor Crowd
31.05.2026 - 12:41:57 | boerse-global.de
Micron's stock surges 878% in a year as binding HBM contracts with hyperscalers lock in 2026 capacity, signaling a structural change from historical boom-bust cycles.
From Cyclical Commodity to AI Bottleneck: How M
2026-05-29
www.cnbc.com
2026-05-29
CNBC
The AI boom is in many ways a hype cycle like no other. Sure, there are comparisons to draw between the dotcom surge of the late 90s and the mobile revolution of the noughties, but in terms of capital invested and lofty predictions on it causing huge societal shifts, it stands ahead of the rest.
The speed of that progress comes with big hurdles. AI builders are having to grapple with constraints
2026-05-29
247wallst.com
2026-05-29
24/7 Wall St.
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2026-05-28
seekingalpha.com
2026-05-28
Seeking Alpha
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2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-28
www.bloomberg.com
2026-05-28
Bloomberg
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2026-05-28
seekingalpha.com
2026-05-28
Seeking Alpha
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2026-05-15
www.startuphub.ai
2026-05-15
StartupHub.ai
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2026-05-14
seekingalpha.com
2026-05-14
Seeking Alpha
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2026-05-07
247wallst.com
2026-05-07
24/7 Wall St.
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