2543 articles
2026-05-22
digitimes.com
2026-05-22
Microsoft is in early discussions to provide AI servers powered by its in-house Maia chips to Anthropic, deepening ties between the two companies as cloud providers race to reduce dependence on Nvidia hardware and secure a stronger position in the AI infrastructure market.
2026-05-22
digitimes.com
2026-05-22
AIC's expansion from analog ICs into fiber-optic components and other products, and its inclusion in a major US cloud service provider's supply chain, extend order visibility to the first quarter of 2027, signaling global demand pressures and supply-chain implications for cloud infrastructure suppliers and telecom equipment markets worldwide.
2026-05-22
digitimes.com
2026-05-22
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng
2026-05-22
digitimes.com
2026-05-22
South Korea announced a national plan to raise domestic production of defense semiconductors to 50% by 2029, targeting heavy reliance on US and Taiwan supply chains to bolster national security. The initiative, unveiled at the 2026 Advanced Strategic Semiconductor Innovation Conference, covers research and development, manufacturing, ecosystem building and workforce training and follows the recent
2026-05-22
digitimes.com
2026-05-22
AI-driven demand and other emerging technologies kept Taiwan's export momentum strong in the first quarter of 2026, with exports reaching US$195.74 billion, rising 51% year on year. Economic growth hit 13.69%, the highest quarterly growth in 39 years. Taiwan's GDP is forecast to reach NT$32 trillion (US$1.02 trillion) in 2026.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su said the company is satisfied with its current CoWoS supply from TSMC, while noting that memory has become another pressure point in the AI chip supply chain.
2026-05-22
digitimes.com
2026-05-22
AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while also revealing a new strategic direction centered on anelevated fanout bridge(EFB)packaging ecosystem.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at expanding Samsung's foundry business by securing another major customer after deals with Tesla and renewed work with AMD. Samsung declined to comment, and MediaTek had not issued an official response by press time.
2026-05-22
digitimes.com
2026-05-22
Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion (approx. US$66.8 billion) in supply chain disruption. The deal eases an immediate labor crisis but leaves unresolved structural conflicts and rising personnel costs.
2026-05-22
digitimes.com
2026-05-22
BOE Technology, China's leading display panel maker, is expanding its push into new businesses beyond panels. The company said on the evening of May 20 that it had signed a three-year memorandum of understanding with US glass materials supplier Corning to cooperate in glass-based packaging substrates, foldable glass, perovskite glass substrates and optical interconnects.
2026-05-22
digitimes.com
2026-05-22
Broadcom, Applied Materials, GlobalFoundries, Meta, and Synopsys are partnering with UCLA Samueli to create a US$125 million Semiconductor Hub to accelerate research and workforce development in AI-driven chip technologies, promising global impacts on computing speed, energy efficiency, and applications from healthcare to transportation while strengthening US competitiveness and innovation globall
2026-05-22
digitimes.com
2026-05-22
Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.
2026-05-22
digitimes.com
2026-05-22
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome
2026-05-22
digitimes.com
2026-05-22
Nanya Technology plans to raise 2026 capital expenditure above NT$52 billion (US$1.64 billion), with chairman Tzou Ming-jen saying the DRAM maker will accelerate new fab construction to capture AI-led memory demand. Equipment installation is scheduled to begin in the first quarter of 2027, followed by mass production in the second half.
2026-05-22
digitimes.com
2026-05-22
InPsytech, the intellectual property unit of Egis Technology Group, announced on May 21 that it hired a former Altera CEO and ex-Intel executive as a senior strategy adviser to support global market expansion and large-scale growth. The firm said the appointment aims to leverage the adviser's semiconductor leadership experience to guide worldwide strategy and help scale the company's business in i
2026-05-22
digitimes.com
2026-05-22
Amid the continued crowding-out effect of artificial intelligence (AI) demand, IC distributor WPG Holdings said memory shortages and rising prices are weakening end-product sales momentum, and forecast that smartphone and PC production will shift from flat growth to a decline in 2026.
2026-05-22
digitimes.com
2026-05-22
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on next-generation 10A and 7A nodes.
2026-05-22
digitimes.com
2026-05-22
At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for AI, and AI-driven quality engineering. Startups, including Enclave Semiconductor, Bedrock Semiconductor, and Lattice, presented solutions aimed at securing and optimizing the global electronics ecosystem.
2026-05-22
digitimes.com
2026-05-22
AMD CEO Lisa Su pushed back against concerns of an AI bubble on May 22, saying demand is "absolutely real" and that the industry remains in an early phase of growth.
2026-05-22
digitimes.com
2026-05-22
Nvidia has positioned its specialized LPX accelerator as a niche product designed specifically for low-latency, high-speed token generation rather than broad-market enterprise workloads. The hardware targets a narrow segment of service providers that operate premium, high-velocity token applications for select customer bases. While the architecture excels at rapid text decoding, its broader market