SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

SK Hynix puts US$64 billion into Cheongju chip buildout

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digitimes.com 2026-07-03

SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.

Intel takes aim at TSMC's CoWoS lead with EMIB-T

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digitimes.com 2026-07-03

As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.

How TSMC quietly turned its supply chain into a 'second fleet'

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digitimes.com 2026-07-03

TSMC has accelerated efforts to localize its supply chain in recent years, using joint development, joint validation, and long-term partnerships to help Taiwanese equipment, materials, and chemical suppliers enter the advanced semiconductor supply chain. The move is steadily building a more resilient and complete local supply system, with both CoWoS and panel-level advanced packaging (CoPoS) now s

Vadzo Validates Falcon-821CRS as a Native Raspberry Pi 4K HDR USB Camera for 4K HDR Imaging on Raspberry Pi 5 - Digital Journal

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www.digitaljournal.com 2026-07-03 Digital Journal

EMIB-T Roadmap, Custom HBM, HBM4 Packaging Challenges, Microfluidic Cooling, Photonic Interconnects, and More - SemiAnalysis

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newsletter.semianalysis.com 2026-07-03 SemiAnalysis

SK hynix to invest $712.5 billion in South Korean operations

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tomshardware.com 2026-07-03 Anton Shilov

SK hynix announces major plan to spend $712.5 billion in its operations in South Korea, but the only detailed investments are spendings on a new NAND fab and a packaging facility.

SK hynix Semiconductor Investment 3D NAND HBM DRAM South Korean Semiconductor Chip Manufacturing Memory Chips

Can AMKR's 2.5D Packaging Pipeline Drive Long-Term Growth? - TradingView

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www.tradingview.com 2026-07-02 TradingView

Underfill Adhesives Market Forecast to 2035: Growth Driven by Advanced Packaging and AI Chips - News and Statistics - IndexBox

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www.indexbox.io 2026-07-02 IndexBox

Nova wins advanced packaging tool order from major foundry - Investing.com

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www.investing.com 2026-07-02 Investing.com

Nova : WMC™ Expanding Adoption Across the Most Advanced Packaging Processes - marketscreener.com

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