digitimes.com
2026-06-11
AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains tight after disrupting the high-end ABF substrate market. HVLP4 copper foil is set to become the next constraint in the second half of 2026.
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s