Semiconductor News & Analysis Feed

GlobalFoundries has successfully validated its SLATE advanced packaging technology on the 9SW platform, marking a significant advancement for next-generation RF applications. This validation demonstrates GlobalFoundries' technical capabilities in advanced packaging and strengthens its competitive po

GlobalFoundries has announced that its SLATE™ wafer-to-wafer bonding technology is now production-ready on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, enabling compact and high-performance front-end modules (FEMs) for next-generation 5G devices. Manufactured at i

GlobalFoundries announces advanced packaging technology adoption on its 9SW platform for next-generation radio frequency applications, marking a significant advancement in semiconductor manufacturing. The 9SW platform's integration of advanced packaging techniques enables substantial performance and