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As demand for AI computing accelerates, the complexity of chip integration is rising rapidly, shifting the competition in advanced packaging beyond individual component performance to system-level reliability and validation across packages, PCBs, and even rack-level infrastructure. TSMC is addressin

Synopsys's continued investment in 3DIC technology demonstrates the semiconductor industry's growing demand for more complex chip architectures. 3DIC technology enables vertical stacking of multiple chips for tighter integration, enhancing performance and energy efficiency while overcoming physical