Semiconductor News & Analysis Feed

Manz Asia's successful delivery of the world's first 310mm×310mm panel-level packaging ECD (Electro-Chemical Deposition) production system represents a significant advancement in semiconductor packaging technology. This breakthrough enables larger panel sizes with enhanced precision, offering improv

Manz's successful delivery of the world's first 310mm x 310mm panel-level packaging electrochemical deposition (ECD) mass-production tool represents a significant advancement in semiconductor packaging technology. This breakthrough demonstrates the industry's shift toward larger panel sizes and more

ASE (Amkor Semiconductor Electronics) has launched automated 310mm panel-level packaging technology, marking a significant advancement in AI chip innovation. This breakthrough addresses the growing demand for high-performance, low-power chips in AI applications such as autonomous driving, cloud comp