Zhen Ding Technology Unit to Invest 12 Billion Yuan in Advanced Packaging Substrate Base - marketscreener.com

Zhen Ding Technology's subsidiary has announced a RMB 12 billion investment to build an advanced packaging substrate production base. This significant move underscores China's continued investment in ... Read original →

This investment marks a strategic push toward domestic breakthroughs in advanced packaging technology, directly boosting upstream material and equipment suppliers while enhancing downstream packaging capabilities. From a compliance standpoint, it strengthens supply chain resilience against external tech restrictions, particularly in high-growth sectors like AI and 5G. In response, global players such as TSMC and Amkor may accelerate investments in China to maintain competitive edge. Over the next 12–24 months, this move will likely catalyze a self-reinforcing ecosystem, accelerating China’s technological leap in advanced packaging and reshaping global semiconductor dynamics.