Zhen Ding launches 1.6T optical modules, 34-layer AI server boards at Semicon Taiwan to meet next-gen AI infrastructure demand

At the 2026 Semicon Taiwan exhibition, Zhen Ding Technology (ZDT) unveiled two core product lines in the AI Technology Zone: high-end optical transceiver modules with 800G and 1.6T transmission capabi... Read original →

Zhen Ding Technology’s unveiling of 1.6T optical modules and 34-layer AI server boards at Semicon Taiwan marks a significant leap in high-bandwidth, high-integration AI infrastructure. From a technical standpoint, this move accelerates upstream optical chip and packaging material development, while pushing downstream data center architectures toward 400G/800G standards. In terms of compliance, given the global semiconductor supply chain’s reliance on Taiwan’s advanced manufacturing, such products may intensify geopolitical tech rivalry, especially amid U.S.-China decoupling trends. Competitors like NVIDIA and AMD are likely to accelerate in-house R&D of optical modules and high-layer PCBs to counter ZDT’s innovation. Over the next 12–24 months, as AI models scale further, demand for high-density interconnects and high-speed transmission will surge, positioning ZDT’s offerings as a new industry benchmark and triggering a technological arms race across the optical and PCB ecosystem.