Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography

The race for AI infrastructure is reshaping the semiconductor supply chain. Intensifying HBM and DRAM shortages are pushing manufacturers to accelerate advanced packaging adoption, particularly EMIB and Chiplet technologies. Ongoing U.S.-China tech restrictions are forcing supply chain reconfiguration, raising compliance costs and prompting increased domestic production. In response, key players like NVIDIA and AMD are investing heavily in next-gen optical transceivers and EUV lithography to maintain competitive edge. Looking ahead, breakthroughs in memory and packaging will define whether AI compute bottlenecks can be alleviated. Geopolitical tensions are accelerating the fragmentation of the global semiconductor ecosystem, fostering a multipolar competitive landscape.