Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry - digitimes

Unimicron has stated that Intel's EMIB-T advanced packaging platform will not achieve true mass production until 2027, intensifying competition in the advanced packaging sector. With TSMC's CoWoS capa... Read original →

Intel’s EMIB-T delayed to 2027 disrupts the advanced packaging landscape, strengthening TSMC’s dominance amid rising demand for high-bandwidth memory and interconnects in AI and data centers. With CoWoS already strained, NVIDIA and other chipmakers are increasingly reliant on third-party packaging, heightening supply chain risks. The delay undermines Intel’s strategic positioning in packaging, while TSMC may accelerate capacity expansion to meet surging demand. In a geopolitically fragmented environment, companies are diversifying suppliers to mitigate risks. Over the next 12–24 months, packaging will become a key differentiator in chip performance and delivery timelines, especially as AI and HPC continue to drive demand for advanced integration technologies.