Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

Intel's EMIB-T delayed to 2027 disrupts global advanced packaging supply chains. With TSMC's CoWoS capacity constrained, vendors are pushing for alternative routes, intensifying competition in the advanced packaging segment. This delay accelerates the need for capacity expansion and technological upgrades among Chinese Taiwan/ Taiwan, China and Chinese Hong Kong/ Hong Kong, China packaging firms, especially in yield improvement and delivery reliability. From a compliance standpoint, geopolitical tensions force companies to reassess supply chain resilience, particularly in critical areas like advanced packaging, where potential tech restrictions and bottlenecks are emerging. In response, TSMC, UMC, and other key players may pursue strategic alliances or M&A to secure market dominance. Over the next 12–24 months, packaging will become a decisive factor in semiconductor competitiveness, especially amid rising demand for AI chips and data center solutions, where packaging capacity directly impacts product success.