UBS: "China's EUV Technology at ASML's 2004 Level... Difficult to Develop Alternative Within 10 Years" - asiae.co.kr

UBS, Switzerland’s largest investment bank, recently stated that China’s extreme ultraviolet (EUV) lithography technology remains at a level comparable to ASML’s in 2004, indicating that it will be di... Read original →

UBS’s report highlights China’s persistent technological gap in EUV lithography compared to ASML’s 2004 standards, underscoring not only a generational lag but also systemic supply chain weaknesses. While China may achieve mass production of DUV equipment within 2–5 years, its throughput and yield remain subpar, constraining overall chip fabrication capabilities. U.S. export controls continue to restrict access to advanced tools, heightening supply chain risks. As ASML and other vendors leverage their technological dominance, China’s path toward self-reliance is increasingly constrained by external barriers. Without breakthrough innovations, the country’s semiconductor advancement will likely stall in the near term. The global industry is realigning, with equipment vendors solidifying their positions, leaving China to navigate a complex trade-off between autonomy and international integration.