U.S. chip scientist says Huawei's plan to make advanced node chips without EUV is "viable" - PhoneArena

A US chip scientist's assessment that Huawei's plan to manufacture advanced node chips without EUV technology is 'viable' has sparked significant attention in the semiconductor industry. This evaluati... Read original →

If Huawei truly achieves advanced-node volume production without EUV, it will force a fundamental reshaping of the semiconductor tech stack: DUV multi-patterning may substitute EUV, but yield and cost pressures will compel EDA, photoresists, and deposition equipment suppliers to rapidly adapt. Foundries may need to offer more customizable process modules. U.S. sanctions aimed to block China’s tech leap, yet they risk accelerating a 'de-Americanized'—not de-globalized—parallel ecosystem, where equipment reuse and tighter design-manufacturing co-optimization become critical. While TSMC and Taiwan, China’s supply chain remain irreplaceable short-term, Samsung and SMIC could recalibrate client strategies to hedge geopolitical exposure. Over the next 18 months, a 'quasi-advanced node' arms race (28nm–7nm) will intensify globally, shifting government subsidies from capacity building toward materials and equipment localization—making chip autonomy a core metric of supply chain resilience.