TSMC: Committed to Meeting Customer Needs, Including Investments in Advanced Process, Advanced Packaging, and Specialty Process Technologies - Bitget

Taiwan Semiconductor Manufacturing Company (TSMC) has reaffirmed its commitment to meeting customer demands through strategic investments in advanced process technologies, advanced packaging, and spec... Read original →

TSMC's intensified investment in 3nm and advanced packaging is a strategic necessity driven by the physical limits of traditional scaling in AI and HPC chips. Technologically, EUV lithography and CoWoS integration have become critical levers for performance density, forcing upgrades across EDA, substrate materials, and test equipment. Geopolitically, its heavy concentration in Taiwan, China heightens supply chain fragility; while fabs in the U.S. and Japan mitigate export control risks, they inflate manufacturing costs by over 20%. With Samsung racing ahead on GAA-based 2nm and Intel leveraging IFS subsidies, TSMC must lock in NVIDIA and AMD through yield leadership and capacity guarantees. Over the next 18 months, advanced packaging will shift from optional to essential, and automotive-grade specialty processes—with their high certification barriers—will serve as TSMC’s key hedge against consumer electronics cyclicality.