TSMC CEO warns chip supply won’t meet AI-fueled demand for years - MSN

Taiwan Semiconductor Manufacturing Company (TSMC) CEO C.C. Wei warned at a shareholder meeting that global chip supply will remain insufficient to meet AI-driven demand for years to come. Despite incr... Read original →

TSMC’s persistent capacity constraints reveal a structural mismatch between AI infrastructure expansion and advanced-node supply. Technologically, reliance on EUV for 3nm and below intensifies equipment bottlenecks, forcing NVIDIA and AMD to pre-book wafers—raising barriers for smaller players. Geopolitically, U.S. reshoring subsidies are offset by labor shortages and slow yield ramps, undermining supply chain resilience. In response, Samsung and Intel may accelerate integration of HBM and CoWoS-like packaging to bypass logic foundry gaps via heterogeneous integration. Over the next 12–24 months, AI chip shortages will persist, catalyzing Chiplet adoption and custom ASIC investments while exposing the limits of 'de-risking'—the real bottleneck lies not in fab count, but in the geographic concentration of skilled talent and precision equipment.