TSMC Bottleneck Reshapes AI Supply Chain as Google, Samsung Expand 2nm, HBM Ties - Seoul Economic Daily

Taiwan Semiconductor Manufacturing Company (TSMC) faces capacity bottlenecks in advanced process nodes, fundamentally reshaping the AI chip supply chain. As major players like Google and Samsung advan... Read original →

TSMC’s 2nm capacity constraints are forcing the AI chip ecosystem to pivot from pure-node scaling toward heterogeneous integration. Technically, surging demand for HBM-logic 3D stacking is accelerating TSV and hybrid bonding R&D at Samsung and SK Hynix, while co-design capabilities across EDA and advanced packaging have become critical barriers to entry. On compliance, U.S. export controls on EUV tools—combined with Taiwan, China’s power and water shortages—are inflating fab expansion costs by over 30%, eroding supply chain resilience. Strategically, Google is diversifying its TPU manufacturing, while Samsung leverages bundled '2nm + HBM4' offerings to undercut TSMC’s dominance. Over the next 18 months, expect a wave of quasi-IDM alliances, where chip designers tightly integrate with memory makers and foundries to bypass node bottlenecks—signaling not just a capacity crunch, but a structural rebalancing of global semiconductor power.