Industry Analysis
Link’s NVIDIA stake reflects institutional conviction in AI infrastructure’s long-term runway. Technically, NVIDIA’s 3nm and EUV commitments pressure TSMC (Taiwan, China) to scale CoWoS advanced packaging, cascading upgrades to EDA, photoresists, and HBM supply chains. Geopolitically, U.S. export controls inflate design/validation costs for China-specific chips like H20, compressing near-term margins. Competitors are exploiting this: AMD and Intel target edge AI with cost-optimized alternatives, while Samsung pushes GAA transistors to leapfrog at 3nm. Over the next 18 months, capital will concentrate on vertically integrated leaders; fabless startups lacking secured foundry access risk exclusion from the high-end AI race.
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