Total Investment of at Least 7.5 Billion Yuan! USC Advanced Packaging Project Lands in Jiading - Gasgoo

On July 30, 2026, Union Semiconductor (USC) held a signing ceremony for its HITS advanced packaging R&D and industrialization project in Jiading District, Shanghai, marking the official landing of the... Read original →

USC’s HITS advanced packaging project in Jiading marks a pivotal step toward China’s self-reliance in high-end chip packaging. Technologically, the initiative targets key bottlenecks such as ultra-fine pitch bump bonding and high-speed chip-to-memory interconnects, directly enhancing capabilities for 3nm and below processes. This move strengthens the regional supply chain in the Yangtze River Delta, creating demand pull for upstream equipment and materials suppliers. In response to global tech restrictions, such localized investments reduce reliance on foreign technologies and mitigate supply chain risks. Competitors like ASMC and Amkor may accelerate their own expansion in China to counter this trend. Over the next 12 to 24 months, the project’s ramp-up will significantly boost China’s capacity in advanced packaging, particularly for AI and data center applications, reinforcing its strategic position in global semiconductor competition.