The semiconductor industry as it is, not as it is told - Evertiq

At the Evertiq Expo Zürich in June 2026, Claus Aasholm from Semiconductor Business Intelligence provided a data-driven analysis of the current semiconductor industry, revealing a structural shift rath... Read original →

The semiconductor industry is undergoing structural realignment, not cyclical recovery. Surging AI chip demand has made advanced packaging and 3nm nodes the new technical fulcrum. TSMC, despite stagnant total capacity, is reallocating investments to EUV-intensive advanced nodes, pressuring OSATs to accelerate heterogeneous integration like CoWoS. Export controls from the U.S., Japan, and South Korea—combined with geopolitical volatility around Taiwan, China—have inflated global supply chain redundancy costs by over 15%. Micron and SK Hynix are leveraging the memory super-cycle to reclaim pricing power, while legacy IDMs lacking HBM and advanced packaging agility face obsolescence. Over the next 12–24 months, market leadership will hinge on co-optimization across packaging, memory bandwidth, and compute density; mere capacity ownership won’t guarantee inclusion in the AI hardware ecosystem.