The Nexus for Silicon Intelligence – Connecting Semiconductor Innovation in the AI Era - Samsung Semiconductor

As AI technology accelerates, the semiconductor industry is entering a critical phase where innovation can no longer rely solely on advanced process technology. The Samsung Foundry Forum 2026, themed ... Read original →

Samsung’s 2026 Foundry Forum signals a strategic pivot beyond node scaling: 3nm and EUV are now table stakes. The real differentiator lies in DTCO and AI-powered design migration, forcing EDA vendors, IP providers, and OSATs to align interfaces around a foundry-centric development ecosystem. Geopolitical fragmentation elevates supply chain resilience but inflates compliance costs, especially under tightening U.S.-EU export controls. TSMC will likely accelerate its TSMC+ integration, while Intel may leverage AI PCs to vertically couple OS and silicon. Over the next 18 months, the industry will shift from 'process leadership' to 'system-level PPA optimization,' granting full-stack collaborative foundries pricing power in AI chips.