SK, TSMC Chiefs Bolster AI Semiconductor Cooperation - 조선일보

Recent meetings between SK Group Chairman Chey Tae-won and TSMC Chairman Che-Chia Wei in Taiwan signal a deepening collaboration in the AI semiconductor sector. This follows SK's earlier discussions w... Read original →

The deepening alliance between SK Group and TSMC signals a strategic pivot toward vertical integration to overcome AI compute bottlenecks. Technically, outsourcing HBM4 base dies to TSMC underscores how EUV and 3nm processes are now essential for memory customization, elevating advanced packaging like CoWoS to a critical performance chokepoint. From a compliance standpoint, while this partnership may ease Western scrutiny over supply chain concentration, overreliance on foundry capacity in Taiwan, China heightens geopolitical exposure. Competitively, Samsung will likely accelerate its HBM4 roadmap and seek alliances with Intel or GlobalFoundries to counter the emerging SK Hynix–TSMC–NVIDIA triad. Over the next 12–24 months, customized AI memory will become a key battleground—only players mastering the trinity of memory, logic, and packaging will dictate ecosystem leadership, leaving fragmented competitors at risk of irrelevance.