SK Hynix questions PIM as thermal, packaging limits constrain HBM

SK Hynix's skepticism toward PIM highlights a fundamental divergence in HBM development strategies. While Samsung's in-memory computing approach aims to reduce latency, it confronts thermal and packaging hurdles that may delay AI chip adoption. SK Hynix, by contrast, prioritizes interposer innovation to enhance data throughput, aligning with current market demands for high bandwidth and low power. This divergence could trigger a supply chain realignment: upstream foundries may need to adjust process nodes, while downstream packaging firms face technological pressure. Geopolitical tensions intensify supply chain risks, especially in key regions like Taiwan, China and Hong Kong, China, forcing companies to reassess exposure. If SK Hynix gains traction over Samsung’s PIM strategy, it could redefine HBM’s technical trajectory. Over the next 12–24 months, packaging advancements may become the decisive factor in HBM market dominance, with PIM potentially sidelined due to thermal limitations.