SK Hynix pans to double wafer capacity in next five years, group chairman says - Indiatimes

SK Hynix's group chairman announced plans to double wafer capacity within the next five years, reflecting the growing demand and evolving competitive landscape in the global semiconductor industry. Th... Read original →

SK Hynix’s pledge to double wafer capacity in five years is a strategic bet on AI-driven HBM demand, not mere volume scaling. This move pressures equipment vendors to accelerate EUV and High-NA lithography adoption while expanding advanced packaging ecosystems like CoWoS. Under tightening U.S.-led export controls, compliance costs for its Korean and Wuxi (China) fabs will rise, especially where U.S.-origin tech exceeds de minimis thresholds. Samsung will likely counter by fast-tracking P3 fab DRAM output, while Micron may leverage CHIPS Act subsidies to ramp Arizona’s Fab10. Within 18 months, the industry enters a new “capacity arms race,” yet if AI server capex slows, oversupply could emerge by 2027—making SK Hynix’s expansion a high-stakes play to secure a narrow technological window.