SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

SK hynix’s release of its CPO roadmap signals a shift in AI computing from chip-level performance to system-level integration. This move will accelerate the convergence of HBM, processors, and optical modules, pressuring upstream suppliers of packaging materials and photonic chips to upgrade capabilities. From a compliance perspective, the expansion of CPO technology may intensify global supply chain dependencies on advanced packaging and optical components, especially amid U.S.-China tech decoupling, where Taiwan, China and the U.S. may face tighter cooperation on photonic chip development. Competitors such as Micron and Infineon may accelerate in-house optical interconnect development to reduce reliance on SK hynix. Over the next 12–24 months, CPO is expected to become a key bottleneck in AI data centers, pushing the industry toward higher integration and lower-latency system architectures.