SK Hynix orders Hanmi equipment for HBM4 capacity buildout

SK Hynix’s move to deploy Hanmi tools signals HBM4 production has shifted from prototyping to full-scale ramp. This accelerates pressure on upstream suppliers to refine TSV and hybrid bonding yields, while boosting demand for advanced packaging materials tied to CoWoS and FOVEROS ecosystems. Amid tightening U.S.-led export controls, reliance on non-U.S. equipment mitigates compliance exposure but risks longer tool qualification cycles and higher per-bit costs. Samsung will likely fast-track HBM4 customer validations, while Micron may leverage AI chipmaker diversification to gain share. Over the next 18 months, the market will face structural oversupply—premium tiers remain tight while mid-tier volumes face margin erosion. Only players with closed-loop control over equipment, process, and end-customer alignment will sustain profitability.